Equipment

Ekra Automatic Printer - Solder paste stencil printer, 22" x 20" size capability

MPM Automatic Printer - Solder paste stencil printer, 22" x 20" size capability

Ekra Semi Automatic Printer - Solder paste stencil printer, 18" x 20" size capability

Juki 750 and 760 - 18" x 20" board size capabilities with a line capacity of 25,650 placements per hour maximum, BGA vision capability

Juki 2060E/2080E and 2050E/2055E - 18" x 22" and 36" x 36" board size capabilities with a line capacity of 80,000 placements per hour maximum, BGA vision capability

Universal pick and place - 18" x 22" board size capabilities with a line capacity of 20,000 placements per hour maximum, BGA vision capability

Heller 1909 EXL Lead-Free Re-flow oven - 9 zone & 2 cooling zone production reflow oven, Lead-Free capabilities

BTU VIP98 Lead-Free Re-flow oven - 7 zone & 2 cooling zone production reflow oven, Lead-Free capabilities, Nitrogen Inert Atmosphere Reflow

IET wave solder - 18" dual wave wavesolder machine

Electrovert Aquastorm 100 - closed loop high pressure water cleaning system

Faxitron X-Ray System - Model CS-100AC with an 18" x 24" capability, 8 Micron focal spot, 8 times – 175 times magnification, 2.5" - .105" field of view

Conceptronic Rework System - Model Freedom HGR 2000 placement and removal system for BGA, micro-BGA, flip chip or fine pitch components. 18" x 20" capabilities, Lead-free (450C) capabilites

Meiji Microscopes - Stereo zoom microscope with oblique 360 degree viewers, .7times – 90 times magnification

Semi-Automatic H Press and Manual Presses - Computerized H Press PHB-12 with 12,000 lbs. pressing capacity, and Arbor #3B with 6000 lbs. pressing capacity with in stock tooling to accommodate many different press fit connectors

Metcal BGA 3101 - Re-ball BGA work station

PCB Baking Oven - Blue M Bake Ovens